| 摘要 |
<p>The present invention relates to a method for producing an electronic network module which is able to create a complicated circuit structure, such as a crossover circuit (transposition circuit) for example. According to the method according to the invention, a substrate is formed from a metal plate, which substrate is in the form of a grid and in the case of which a multiplicity of platelet supporting regions are connected to one another by means of first connecting regions in the form of a grid, and in the case of which these first connecting regions are connected to one another by second connecting regions in grid form, a frame body and a frame, which extends laterally from the substrate which is in the form of a grid, in each case creating a plurality of conductor connections which are provided between the substrates, which are in the form of grids, and the frame, in a manner such that they can be bridged. The first connecting regions and second connecting regions are cut away at the desired points, and a desired electrode pattern is formed by means of the remaining connecting regions and each platelet supporting region, after which an electronic component, which is in the form of a platelet, is then in each case placed and fixed between the desired platelet supporting regions, after which the substrate, which is in the form of a grid, including the electronic components, is enclosed in a sealing and integrating manner in a plastic material, and the conductor connections are finally cut away from the frame. <IMAGE></p> |
