NEW POLYMER RESIN COMPOUNDS AND PHOTORESIST COMPOSITION INCLUDING NEW POLYMER RESIN COMPOUNDS

摘要

A polymer resin compound is provided to obtain a photosensitive resin composition which has excellent light sensitivity and improved alkali developability at a non-crosslinked portion, and causes little deformation by heating. An alkali-soluble polymer resin compound comprises a monomer with a multicyclic structure represented by the following formula 1. In formula 1, A1, A2 and A3 are the same or different, and each is selected from H, a C1-C6 alkyl, C1-C6 haloalkyl, C1-C6 alkyl containing at least one heteroatom, substituted or non-substituted C6-C20 aryl, and C2-C5 alkyl carboxylic acid; X is selected from -(CH2)n-, -O-, -S-, -NH-, -C(O)O-, substituted forms and oxides thereof, wherein n is an integer of 1-4; and Y is a group derived from a compound represented by the following formula 2 or 3. In formula 2, l, m and n are the same or different and each is an integer of 1-6; and Aa1, Aa2 and R are the same or different and each is selected from H, a C1-C6 alkyl, C1-C6 haloalkyl, C1-C6 alkyl containing at least one heteroatom, substituted or non-substituted C6-C20 aryl, and C2-C5 alkyl carboxylic acid. In formula 3, k, l, m, n, o and p are the same or different and each represents an integer of 1-4; and Bb1, Bb2, Bb3, Bb4 and R are the same or different, and each is selected from H, a C1-C6 alkyl, C1-C6 haloalkyl, C1-C6 alkyl containing at least one heteroatom, substituted or non-substituted C6-C20 aryl, and C2-C5 alkyl carboxylic acid.