发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve the reliability of the bonding jointing of an Al wire by mounting a pushing member pushing an ultrasonic joining section for the Al wire from an upper section. CONSTITUTION:The reliability of a bonding joining section can be enhanced by pushing a pushing member 9 against an Al wire joining section from an upper section. A cover for a package can be utilized as a means by which load is applied to the pushing member 9. There is no possibility that electrical joining is affected even when joining is insufficient due to the fouling, flaws, etc. of electrode surface by applying load to the joining section. For making the pushing pressure constant, the material of an elastic body is used as contact sections with the Al wires and contact sections with the cover or pressure is applied through a spring, etc. The pushing member is mounted, pressure is applied from the upper section of the joining section of the Al wire and the strength of the joining section is increased, thus also eliminating the need for ensuring joining strength by a tension meter.
申请公布号 JPS621240(A) 申请公布日期 1987.01.07
申请号 JP19850141134 申请日期 1985.06.26
申请人 MITSUBISHI ELECTRIC CORP 发明人 KITAMURA TAKAYUKI
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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