| 摘要 |
PURPOSE:To automate work by boring a through-hole for preventing the outflow of solder for mounting to a metallic stem jacket body for a stem base. CONSTITUTION:A metallic stem jacket body 1 consisting of a metal such as covar has oblong through-holes 9, 9 molded through press working, external leading-out leads 2, 2 are both sealed with boro-silicate glass 3 filled into the jacket body 1, and the through-holes 9, 9 are filled with glass 3. An assembly in which a semiconductor element 4 is mounted to a steam base with gold alloy group solder 5 consisting of Au-Si, Au-Sn, etc. and bonded onto a surface electrode for the semiconductor element, the top sections of the external leading- out leads 2, 2 and the surface of the metallic stem base by metallic small-gage wires 6, 6, 7, such as Au, Al, etc. is hermetically sealed by a metallic cap 8 composed of a Fe, a Fe group alloy, cupro-nickel, etc. through resistance welding. The outflow of solder 5 can be prevented at boundaries among the through- hole sections and the metallic steam base section, and the semiconductor element can be bonded at a predetermined position when the semiconductor element is bonded with the surface of the metallic stem base by the metallic small-gage wires, thus automating bonding. |
