| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which, when used to form an interlayer insulation film under a baking condition of <250°C, can form an interlayer insulation film having high heat resistance, high solvent resistance, a high transmittance and a low dielectric constant, and which, when used to form microlenses, can form microlenses having a high transmittance and a good melt shape. <P>SOLUTION: The radiation-sensitive resin composition comprises [A] a polysiloxane having at least one group selected from the group consisting of an oxiranyl group and an oxetanyl group, and a functional group capable of addition reaction to an oxiranyl group or an oxetanyl group, and [B] a 1,2-quinonediazide compound. <P>COPYRIGHT: (C)2009,JPO&INPIT |
