| 摘要 |
PURPOSE:To reduce the crosstalks generating among a plurality of wirings by a method wherein a gap or more between adjacent wirings are provided with conductors, which are individually connected to ground electrodes on the semiconductor chip mounting plane of a package. CONSTITUTION:The conductors 11 are arranged between adjacent wirings 6. The side surface connects a ground terminal 8 in the semiconductor chip 2 side as show on the right side of the semiconductor chip 2. The conductors 11 are integrally formed on the semiconductor chip 2 in the form of beam leads, or are formed on the chip 2 and the package by split in the halfway. At the time of mounting the chip 2 on the package 1, both which have been split are joined with solder; otherwise, in case of small intervals of the wirings 6, the surface of the conductor 11 is coated with phospho-silicate glass, so as not to come into short circuit even in the contact of the wirings 6. The electric field formed between adjacent wirings 6 is shielded by a conductor 11, resulting in the reduction of the generation of crosstalk. |
