发明名称 RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
摘要 <p>PURPOSE:The titled one-pack type composition, containing a liquid epoxy resin, fused silica and dihydrazino-methylamino-s-triazine and having high reliability in heat cycle tests and biasing tests at high temperatures under high humidities. CONSTITUTION:A resin composition containing (A) a liquid epoxy resin, e.g. epichlorohydrin bisphenol A type epoxy resin, (B) fused silica, preferably having 10-100mum average particle diameter and (C) 2,4-dihydrazino-6-methylamino-s- triazine. Preferably, the contents of the components are as follows; 55-65wt% component (B) and 9.0-22.5pts.wt., based on 100pts.wt. component (A), component (C).</p>
申请公布号 JPS61296022(A) 申请公布日期 1986.12.26
申请号 JP19850141043 申请日期 1985.06.25
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 TSUJIMOTO MASAYA;FUKUI TARO;HASHIMOTO SHINJI;HINO HIROHISA
分类号 C08G59/00;C08G59/50;C08K3/00;C08K3/34;C08K3/36;C08K5/34;C08L63/00;H01L23/29;H01L23/31 主分类号 C08G59/00
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