| 摘要 |
PURPOSE:To uniformly and thinly stick a flux onto the surface of a printed wiring board by diffusing the fine granular flux for soldering and bringing the same into contact with the surface of said board. CONSTITUTION:The flux 16 for soldering is preliminarily filled into a flux chamber 1 up to the level at which about 1/3 the circumferential part of a sticking drum 4 is immersed therein. A motor 7 is driven to rotate the drum 4 and air is at the same time fed to the inside of a stationary shaft pipe 2 from which the air is blown out. Then the flux 16 on a wire net 10 is segmented to pulverous particles and the mist-like flux 17 is diffused and ejected from a spray port 14 in the stage when the blown-out air passes the net 10. The flux 17 is therefore uniformly and evenly coated on the bottom surface of the printed wiring board 15 when the board 15 is conveyed in the direction orthogonal with the arrow B direction and is passed above the port 14.
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