发明名称 |
CONDUCTIVE SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a conductive substrate having excellent conductivity and adhesion.SOLUTION: The conductive substrate is a laminate which comprises a porous copper layer on one surface side of an insulation resin base material, where holes of the copper layer at least partially include a base material-derived component-containing area containing a component derived from the insulation resin base material, and the copper layer has a volume resistivity of 20 μΩ/cm or less.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016110690(A) |
申请公布日期 |
2016.06.20 |
申请号 |
JP20140243520 |
申请日期 |
2014.12.01 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
TAGUCHI YOSUKE;OMORI YOSHINOBU;SHIBATA TAKASHI |
分类号 |
H01B5/14;B32B5/18;B32B15/08;H05K3/38 |
主分类号 |
H01B5/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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