发明名称 CONDUCTIVE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a conductive substrate having excellent conductivity and adhesion.SOLUTION: The conductive substrate is a laminate which comprises a porous copper layer on one surface side of an insulation resin base material, where holes of the copper layer at least partially include a base material-derived component-containing area containing a component derived from the insulation resin base material, and the copper layer has a volume resistivity of 20 μΩ/cm or less.SELECTED DRAWING: Figure 1
申请公布号 JP2016110690(A) 申请公布日期 2016.06.20
申请号 JP20140243520 申请日期 2014.12.01
申请人 DAINIPPON PRINTING CO LTD 发明人 TAGUCHI YOSUKE;OMORI YOSHINOBU;SHIBATA TAKASHI
分类号 H01B5/14;B32B5/18;B32B15/08;H05K3/38 主分类号 H01B5/14
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