| 摘要 |
PURPOSE:To make the centering motion of a wafer performable without using a chuck for sticking release with the wafer, by installing a guide for releasing a pair of opposed holding devices when a rotating arm is set to horizontality. CONSTITUTION:A silicon wafer 1 is conveyed onto a circular table, and an arm unit is slightly rotated in a vertical direction,layer claws 4a, 4b and 5a, 5b upside down, then the wafer 1 is held while centering it. Next, after spattering is applied to the wafer 1 at a vertical position, again the arm unit is rotated and the circular table 2 is put back to a horizontal position. At this process, these claws 4a, 4b and 5a, 5b are moved beneath each of guides 7a, 7b and 8a, 8b, thus holding of the wafer 1 is released.
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