| 摘要 |
PURPOSE:To punch an unnecessary section in a lead frame material for an IC effectively by placing the frame material on the surface of a die and generating electromagnetic force required for processing in an electromagnetic molding coil arranged to the upper section of the frame material. CONSTITUTION:A die 7 to which an opening is bored in a predetermined punching pattern is arranged to a lower section oppositely faced to a coil 3 for molding. The coil 3 is disposed to the lower section of a capacitor 4. The currents of a DC high voltage generator 1 are stored in the capacitor 4 by closing a charging switch 2. The charging switch 2 is opened, and a discharge switch 5 is closed, thus instantaneously flowing large currents through the coil 3, then forming a magnetic field around the coil 3. A disuse section in a lead frame material 6 for an IC placed on the surface of the die 7 is struck against the die 7 by the action of pulse-shaped electromagnetic force being generated, and punched instantaneously.
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