ELECTROPLATING DEVICE FOR LOCALLY APPLYING A METAL DEPOSIT TO AN ELONGATE METAL TAPE OR THE LIKE

摘要

An electroplating device for locally applying a metal deposit to an elongate metal tape or to metal objects united in an elongate tape or the like in which the tape is guided along a roller adapted to rotate about a rotary axis in operation and being dipped at least partly in an electrolyte solution and in which the tape is transported parallel to the rotary axis of the roller in a manner such that the parts of the tape to be provided with the metal layer come into contact with the roller whereby the device comprises a guide surface which is stationary during operation in the direction of transport of the tape, along which surface the tape is displaced during operation, and a guide rim extending parallel to the rotary axis of the roller and protruding out of the guide surface for the edge of the elongate tape remote from the roller, against which rim the edge of the elongate tape is pressed with the aid of wheels pressing the tape against the guide surface and having their rotary axes at an acute angle to the direction of displacement of the tape.