Cooling equipment for an integrated circuit chip

摘要

Cooling equipment for use in electronic systems of type having a substrate with a plurality of heat-generating electronic components mounted thereon is disclosed. A hat assembly is provided having a plurality of cavities in which pistons can be slidably mounted. The hat assembly is placed adjacent to the substrate such that the pistons are next to the components. The pistons are then adjusted and fixed in the hat assembly so that a desired gap is maintained between the pistons and the components. A cooling plate is attached to the assembly.