| 摘要 |
PURPOSE:The titled material, obtained by incorporating hydrotalcite compound with an epoxy resin and capable of reducing contained impurities and giving sealed materials for electronic parts having remarkably improved moisture resistance and corrosion resistance. CONSTITUTION:An epoxy resin molding material containing 0.1-10wt%, based on the total amount, hydrotalcite compound. A polyfunctional epoxy resin having preferably >=2 epoxy groups in one molecule is used as the epoxy resin.
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