发明名称 RESIN COMPOSITION FOR EXTRUSION MOLDING
摘要 PURPOSE:To provide a resin composition obtained by compounding an ethylene copolymer with an antiblocking agent and an organic amide compound, and having remarkably well-balanced transparency, blocking property, slipperiness and printability. CONSTITUTION:The objective composition is produced by compounding (A) 100pts.(wt.) of an ethylene copolymer produced by the use of a Ziegler catalyst and having a density of 0.910-0.940g./cm<3>, a melt flow rate of 0.01-20g/10min and a comonomer content of 1-10wt% with (B) 0.01-1pt. of an antiblocking agent (e.g. silicon dioxide having an average particle diameter of >=10mu and (C) 0.01-1pt. of organic amide compounds composed of a combination of an unsaturated fatty acid amide and a saturated fatty acid amide. The component C is preferably a 3:1 mixture of a saturated fatty acid amide and an unsaturated fatty acid amide.
申请公布号 JPS61281143(A) 申请公布日期 1986.12.11
申请号 JP19860099797 申请日期 1986.04.30
申请人 MITSUBISHI PETROCHEM CO LTD 发明人 YAMAMOTO KOJI;ONISHI AKINORI
分类号 B29C47/00;B29K23/00;B29K105/00;C08K3/34;C08K5/17;C08K5/20;C08K13/02;C08L7/00;C08L21/00;C08L23/00;C08L23/08;C08L101/00 主分类号 B29C47/00
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