| 摘要 |
PURPOSE:To obtain the device to be used for examination of wirings by a method wherein, after the elements to be used for a master slice IC were provided on a semiconductor substrate and they have been interwired, the interwiring necessary for desired operation is left, and the other interwirings are cut off. CONSTITUTION:A circuit element Tr, R and the like are formed on a semiconductor substrate S in the same process as the master slice IC which is the final article of manufacture, and a wiring L is formed irrespective of a circuit operation. Then, the unnecessary wiring Lo is cut off using a laser beam B, an examination device is completed by adjusting the above to the desired IC, a characteristic test is performed, and a metal mask is designed based on the result of the abovementioned test. According to this constitution, the cutting of wires is easier than the adding of the wires, the characteristics of IC can be tested by the device for examination of the wiring pattern which will soon be formed into the final finished product, and the design of wiring can be made easier, thereby enabling to facilitate the manufacture of the master slice IC. |
