发明名称 Method for inserting multilead components into printed wiring boards
摘要 A method for inserting a multilead component (30) into a printed wiring board (31) (PWB), wherein the component has its leads (32, 33) arranged in two or more rows and the PWB (31) has two or more rows of apertures (36, 37) arranged in a pattern corresponding to that of the leads of the component. The method comprises spreading the lead rows of the component (30) further apart than the aperture rows of the PWB (31); placing the component on the PWB (31) and applying a downward insertion force (41) thereon; vibrating the component (30) and the PWB (31) relative to each other; and moving the lead rows toward the aperture rows thereby inserting each lead in its corresponding aperture in the PWB.
申请公布号 US4627161(A) 申请公布日期 1986.12.09
申请号 US19850747694 申请日期 1985.06.24
申请人 AT&T TECHNOLOGIES, INC. 发明人 CUSHMAN, ROBERT H.
分类号 H05K3/30;H05K3/34;H05K13/04;(IPC1-7):H05K3/30 主分类号 H05K3/30
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