| 摘要 |
An electrically conductive path through an insulating plate (10) is produced by forcing sheets of conductive material (13, 14) into contact through a hole (11) in the plate (10). The sheets (13, 14) are forced together with sufficient force to produce a cold weld junction, which is then plated with a conductive metal (102). Dies for producing the cold weld utilize metallic spheres (110), rods (188) or chemically etched projections (228). Shaped dies (268, 272) form a crimped joint without a cold weld, and offset dies (246, 250) produce a raised junction (252) for use as a mount for a planar component. In manufacturing a printed circuit board (160) the cold weld die (158) is produced with the same drill hole pattern as used to form the drill holes in the printed circuit board (160). A force sufficient to cause metalurgical bonding of the opposed conductors may also be applied by an explosive discharge. A hole in the junction area of the opposed conductors may be created or enlarged by the use of a laser beam. Opposing conductive foils on either side of a hole in a dielectric material may also be joined by fusing with a laser beam.
|
