| 摘要 |
PURPOSE:To improve the corrosion resistance of alloy and to stabilize a plated film by coating an anodizing film and an electrically-conductive resin film on the surface of Mg alloy and forming a required plating layer thereon. CONSTITUTION:Two layers of the anodized film 5 of Mg having about 7mum film thickness and an electrically-conductive resin layer 6 having about 10-20mum film thickness are formed on the surface of Mg alloy 1. The two layers 5, 6 are made to a substrate and a Cu plated layer 3 having about 2-5mum film thickness and the finally necessitated Au and Ag platings successively are formed thereon. As the above-mentioned electrically-conductive resin, when Ag powder and Al powder or the like are dispersed in the resin and the resin which is high in the adhesion properties for an anodized treatment surface and resistant to chemicals is used, the corrosion resistance is increased. This plating method can be applied to a satellite embarking device or the like.
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