| 摘要 |
PURPOSE:To remove mutual interference between respective circuit elements mounted in high density, and to obtain stable action of a hybrid integrated circuit by a method wherein conductor layers for non-grounding are coated with insulating resin, and the insulating resin thereof and conductor layers for grounding are coated with conductive resin. CONSTITUTION:Conductor layer 2 for grounding and conductor layers 3 for non-grounding of the plural number respectively are provided on an insulating substrate 4, and integrated circuits 6 of the plural number are mounted on the conductor layers 2, 3. The conductor layers 3 for non-grounding at such a hybrid integrated circuit are coated with insulating resin 8, and the insulating resin 8 thereof and the conductor layers 2 for grounding are coated with conductive resin 9. For example, the insulating substrate 4 of alumina, etc. formed with the conductor layers 2 for grounding and the conductor layers 3 for other than grounding of the plural number respectively are adhered to be arranged on the prescribed positions of the top surface and the under surface on a metal sheet 1 of copper, etc. to be sued both as a heat sink and as a grounding, the circuit elements 6 are equipped according to soldering between both the conductor layers 2, 3, and insulating epoxy resin 8 is applied on the top surface of the conductor layers 3 for other than grounding. Moreover, the conductive resin 9 is coated on the conductor layer 2 for grounding and the insulating resin 8.
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