| 摘要 |
<p>PURPOSE:To contrive the improvement in workability by facilitating the transportation of pellets without a slip of position by irradiating a desired part except at least the part corresponding to a frame of an adhesive sheet with ultraviolet rays so as to reduce the adhesion property of said sheet after pelletizing of wafers. CONSTITUTION:A wafer adhesion structure 8 transported to the ultraviolet ray irradiation step by an adsorption pad 12 is mounted on the ultraviolet ray irradiation device 13 which is composed of a chamber 16 provided with opening 15 of a predetermined shape on its uppermost plane 14 and a shutter 17 is mounted under the opening 15 freely to open and close. The wafer adhesion structure 8 is put on the uppermost plane 14 of the chamber 16 and it is positioned by a proper positioning means so that the opening 15 comes corresponding to the pelletized wafers 2. Under these conditions, the shutter 17 is released to irradiate a desired part except the part corresponding to a frame 7 of an adhesive sheet 3' with ultraviolet rays from an ultraviolet ray generating source 18, thereby reducing the adhesion property of that part.</p> |
