| 摘要 |
PURPOSE:To realize a package having high density by forming a lead frame in multilayer structure, in which a plurality of conductive layers are insulated mutually, and wire-bonding each conductive layer and different electrodes on a semiconductor element. CONSTITUTION:A lead frame is formed in multilayer structure in which sections among first conductor layers 15 and second conductor layers 16 are insulated electrically by insulating layers 17. Sections among the end sections 15A of the first conductive layers 15 in several external lead 11 and the end sections 16A of the second conductive layers 16 and different electrodes 18 on an IC chip 14 are bonded by wires 19, the electrodes 18 on the IC chip 14 are lead out electrically to the outside, a desired section is molded by a resin, and sections among external leads are isolated electrically, thus completing a semiconductor device. Accordingly, the same result as two external leads are wire-bonded is obtained in one external lead, and the mounting density of a package can be doubled. |
