发明名称 Multilayer series-connected coil assembly on a wafer and method of manufacture
摘要 A coil assembly has flat spiral conductive coils on an insulative slab. The coils are respectively covered by alternate insulative layers having open areas exposing inner ends of the coils to which conductive jumpers are connected. Outer ends of the coils are connected to other conductive pads on the slab. The coils are connected in series via the jumpers.
申请公布号 US4626816(A) 申请公布日期 1986.12.02
申请号 US19860836634 申请日期 1986.03.05
申请人 AMERICAN TECHNICAL CERAMICS CORP. 发明人 BLUMKIN, RUBIN;PEREIRA, JR., ROBERT
分类号 H01F27/28;H01F41/04;(IPC1-7):H01F27/28 主分类号 H01F27/28
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