| 摘要 |
PURPOSE:To manufacture lead material for electronic parts excelled in various characteristics required of lead material by subjecting a Cu alloy containing additive elements such as Ni, Sn, Zn, etc., to hot rolling, cold rolling, including annealing treatment and temper rolling under specific conditions. CONSTITUTION:An ingot of Cu alloy containing, by weight, 1.0-3.5% Ni, 0.2-0.9% Si, 2.0-4.5% Sn, 0.1-5.0% Zn, 0.02-1.0% Mn and 0.0005-0.02% of 1 or >=2 elements among Mg, Cr, Ti and Zr is prepared. After subjected to facing of its surface, the ingot is hot-rolled to form a plate of about 10mm thickness, which is water-cooled from >=600 deg.C at >=5 deg.C/sec cooling rate to undergo surface descaling, cold-rolled to 0.43mm thickness and annealed at 400-600 deg.C for 5sec-4hr. In this way, the lead material for electronic parts excelled in repeated bendability, spring characteristic, heat resistance, thermal peeling resistance of tinning film and solder, and stress corrosion resistance can be obtained. |
