| 摘要 |
PURPOSE:To form a vapor deposited Au film without corroding Ta in a filament attaching part by winding a Ta strip to an Mo supporting bar, attaching the filament thereto, winding the filament further with the Ta strip and covering the same with an Mo strip. CONSTITUTION:The filament for bombardment or ionization filament 6 of vapor deposition device for the thin film is attached to the Mo supporting bar 7 wound with the Ta strip 20. The Ta strip 20 is further wound around the fialment and the Mo strip 21 is wound thereon and is spot-welded. Then the Ta is protected by the Mo and therefore the corrosion of the Ta is prevented in the case of depositing Au by evaporation.
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