发明名称 ELECTRONIC COMPONENT PACKAGE
摘要 <p>PURPOSE:To simplify the mechanism of a hand holding a flat-pack integrated circuit (FIC) and avoid the bending of pins by a method wherein the FIC package is provided with guide holes or grooves for positioning so as to be held and positioned at the same time by an attracting hand or the like. CONSTITUTION:Two guide holes 7 are provided in the top surface of an FIC for position correction of X, Y and theta directions. The FIC is positioned by positioning jigs 10 inserted into the guide holes 7 and attracted by an attracting pad 11 actuated by vacuum attraction. The guide can be either a hole or a groove or a protrusion with a shape which facilitates positioning the FIC to X, Y and theta directions. It is preferred that the same respective diameters and the same respective depths and the same spacing of the two guide holes are employed for different types of FICs because the same hand which holds the FIC can be used. When square grooves are employed, it is also preferred that the same shapes of the squares, the same areas of the squares and the same depths of the grooves are employed for different types of the FICs.</p>
申请公布号 JPS61256655(A) 申请公布日期 1986.11.14
申请号 JP19850097713 申请日期 1985.05.10
申请人 HITACHI LTD 发明人 KATO SHUZO;ISHIMURA HIROSHI
分类号 H01L23/04;H01L23/00;H01L23/544;H05K13/04 主分类号 H01L23/04
代理机构 代理人
主权项
地址