| 发明名称 |
Thermosetting resin composition. |
| 摘要 |
<p>Thermosetting resin compositions of the present invention comprise a thermosetting resin and a specified class of cured polyorganosiloxane resins dispersed as extremely fine particles in the thermosetting resin. Moldings and other shaped articles prepared using these compositions are flexible and exhibit small coefficients of thermal expansion and low shrinkage during molding.</p> |
| 申请公布号 |
EP0201176(A2) |
申请公布日期 |
1986.11.12 |
| 申请号 |
EP19860302136 |
申请日期 |
1986.03.24 |
| 申请人 |
TORAY SILICONE COMPANY LIMITED |
发明人 |
MORITA, YOSHITSUGU;SHIRAHATA, AKIHIKO |
| 分类号 |
C08J3/12;C08L83/04;C08L101/00;(IPC1-7):C08L101/00 |
主分类号 |
C08J3/12 |
| 代理机构 |
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代理人 |
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| 地址 |
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