PLANARIZING LAYER FOR SEMICONDUCTOR SUBSTRATES SUCH AS SOLID STATE IMAGERS

摘要

PLANARIZING LAYER FOR SEMICONDUCTOR SUBSTRATES SUCH AS SOLID STATE IMAGERS A device is disclosed comprising a non-planar semiconductor substrate and a planarizing layer thereon, the planarizing layer having a maximum thickness that is no greater than about 3.mu. and a planarization factor P?1.0. In a preferred embodiment, the layer comprises a polymer formed from a liquid monomer coated onto the substrate and thereafter polymerized.