| 摘要 |
PURPOSE:To enable to couple with a high coupling efficiency, by arraying a first spherical or semi-spherical lens on a light-emitting semiconductor device, by sealing the light-emitting semiconductor device by an enclosure, and by mounting a second spherical or semi-spherical lens on the enclosure with the optical axis aligned with the first lens. CONSTITUTION:On the central portion of a substrate 1, a light-emitting diode 2 is mounted, whose electrode is connected to an external lead 3 with fine metal wire 4, and a spherical lens 5 is bonded to the light emitting face of the light-emitting diode 2 with adhesive 5 such as epoxy resin. Next, they are sealed with a cap 8 through which a spherical lens 9 made of low melting-point glass is mounted at the central portion of the top plate. At this time, it is important to cause the optical axes of the spherical lens 9 mounted through the cap 8 and the spherical lens 5 lying on the light-emitting diode to coincide with each other, and in this invention, this optical axis alignment is easily attained by positioning correctly the light-emitting diode 2 in mounting it. In this way, the higher coupling efficiency can be attained. |
