| 摘要 |
PURPOSE:To prevent any chip and circuit contained in a box-type substrate from short-circuiting by a method wherein metallic seals are arranged on the peripheral part of a box-type substrate to absorb any particles flew therein in case they are heated. CONSTITUTION:Molten solder particles 6 flew in a box-type substrate 1 are produced due to pressure difference caused by temperature flucatuation in case solder is molten by heated gas destroying the solder. Metallic seals 7 arranged on the peripheral part of a base 1a in the box-type substrate 1 are soldered or plated to provide itself with excellent solder wetting. Through these procedures, the solder particles 6 need not be prevented from flying in the substrate box since any molten solder particles flew in the box-type substrate 1 in case they are heated can be absorbed into the metallic seals 7. |
