发明名称 ULTRASONIC THICKNESS MEASURING DEVICE
摘要 PURPOSE:To make information on film thicknesses of a rough plated surface available, by employing focusing ultrasonic-wave or allowing a reflected ultrasonic-wave signal from the plated film to interfere between another reference signals for checking degree of interference. CONSTITUTION:With a series of ultrasonic-wave styluses performing a X-Y plane instrumental 2-dimensional scanning with a 2-dimensional instrumental scanning system 120, a video signal representing a magnitude of reflected ultrasonic wave from an object to be plated 95 located inside a plating chamber 96 is displayed on a cathode-ray tube 130 for depicting plated condition of the object 95. Next, the object 95 is scanned in the direction of Z-axis with the instrumental scanning system 120. And, with a plated film 98 depositing over the object 95, as the surface of the film 98 approaches a stylus 70, when the stylus 70 in the Z-direction is so displace that its focus coincides with its surface, the displaced distance on the Z-axis becomes to represent the thickness of the film 98. Thus, the plated film thickness can be measured regardless of existence of undulations on the surface to be plated.
申请公布号 JPS61253413(A) 申请公布日期 1986.11.11
申请号 JP19850095438 申请日期 1985.05.07
申请人 HITACHI LTD 发明人 KANDA HIROSHI;KATAKURA KAGEYOSHI;ISHIKAWA KIYOSHI
分类号 G01B17/02;(IPC1-7):G01B17/02 主分类号 G01B17/02
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