| 摘要 |
PURPOSE:To make it possible to push up a wafer quietly so as to contact with a mask with a uniform force, by sucking the semiconductor wafer to a vacuum sucking pad on an X-Y table, reducing the pressure on the lower surface side of the mask, moving the X-Y table for position alignment, jetting a gas through the vacuum sucking pad, and floating the semiconductor wafer. CONSTITUTION:Small holes 2 are formed in a vacuum pad, which is provided on an upper stage table 1b of an X-Y table 1. The small holes 2 are connected to a nitrogen cylinder 6 and a vacuum pump 7 through an electromagnetic valve 5 so that switching can be performed. When the electromagnetic valve 5 is operated at a position A and communicated to the vacuum pump 7, a wafer 3 is sucked and held to the upper stage table 1b as shown by an imaginary line. Under this state (the position at the imaginary line), the X-Y table 1 is operated, and accurate position alignment is performed with respect to a mask 4. Then, the electromagnetic valve 5 is switched to a position B and communicated to the nitrogen bomb 6. N2 gas is jetted through the small holes 2 in the sucking pad. Then, the wafer 3 is pushed up with the N2 gas and closely contacted to the mask 4. |
