发明名称 HYBRID INTEGRATED CIRCUIT DEVICE AND LEAD FRAME FOR THE SAME
摘要 PURPOSE:To simplify a structure, reduce the number of connections, improve a quality and facilitate cost savings by a method wherein an element is mounted on an island part and the element, partial frames and external lead terminals are mutually wired. CONSTITUTION:A hybrid integrated circuit device includes an island part 1 on which an element is mounted, at least one partial frame 4 provided around the island part 1 electrically independent from a lead frame, external lead terminals 2 provided surrounding the partial frame 4 and the island part 1 and an insulation sheet 3 which maintains at least the partial frame 4 at the specified position, and can be assembled by mounting the element on the island part 1 and mutually wiring the mounted element, the partial frame and the external lead terminals by bonding wires. Especially, when a plurality of the elements are mounted on the island part, a common wiring can be connected to an external terminal through a partial frame so that the bonding process can be simplified and the number of the external terminals can be reduced.
申请公布号 JPS61248456(A) 申请公布日期 1986.11.05
申请号 JP19850089318 申请日期 1985.04.25
申请人 NEC CORP 发明人 SENBA NAOHARU
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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