SEMICONDUCTOR DEVICE AND ITS FITTING BOARD

摘要

PURPOSE:To fit pins to a board without damaging the wiring part of the board by a method wherein the pins which can be connected elastically and can be mated and unmated freely and thru-hole electrodes into which the pins are inserted are provided. CONSTITUTION:A large number of thru-holes 11 are formed in a board 2 in a matrix arrangement. A metallized wiring 3 formed on the surface of the board 2 is extended onto the inside wall surface of the thru-hole 11 to form a thru-hole electrode 12. Pins 13 are made of fine wires and their two ends are formed to have wave shapes and the formed ends are bent inward. Those pins 13 are inserted into the thru-holes 11 and contacted electrically with the thru-hole electrodes 12. The wave shape part 13a of the pin 13 has a high elasticity and the pin 13 is held in the thru-hole 11 by that elasticity. With this constitution, the damage of the metallized wiring 3 in the neighborhood of the thru-hole 3 caused by the fitting of the pin 13 can be avoided and, as solder is not used, discontinuity caused by the fatigue of the solder does not occur.