摘要 |
PURPOSE:The titled inexpensive molding material excellent in moldability, moisture resistance and cracking resistance, comprising a specified epoxy resin and a polyphenol novolak resin as a curing agent. CONSTITUTION:An epoxy resin (A) (e.g., polyfunctional novolak epoxy resin) having an epoxy equivalent weight <=350g/eq., a PC extraction electric conductivity <=50mus/cm, a halogen content <=100wt. ppm, a content of organic acids except phenols <=500ppm and a content of other electrolytes <=100wt. ppm is mixed with a curing agent (B) comprising a polyfunctional phenolic novolak resin having a OH equivalent weight <=250g/eq., a PC extraction electric conductivity <=50mus/cm, a content of organic acids except phenols <=500wt. ppm and a content of other electrolytes <=100wt. ppm in amounts to provide an A/B volume ratio of 0.8-1/1-0.8 and, optionally, 0.01-0.5wt% cure accelerator (C) such as an imidazole.
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