发明名称 EPOXY RESIN MOLDING MATERIAL FOR SEALING SEMICONDUCTOR
摘要 PURPOSE:The titled inexpensive molding material excellent in moldability, moisture resistance and cracking resistance, comprising a specified epoxy resin and a polyphenol novolak resin as a curing agent. CONSTITUTION:An epoxy resin (A) (e.g., polyfunctional novolak epoxy resin) having an epoxy equivalent weight <=350g/eq., a PC extraction electric conductivity <=50mus/cm, a halogen content <=100wt. ppm, a content of organic acids except phenols <=500ppm and a content of other electrolytes <=100wt. ppm is mixed with a curing agent (B) comprising a polyfunctional phenolic novolak resin having a OH equivalent weight <=250g/eq., a PC extraction electric conductivity <=50mus/cm, a content of organic acids except phenols <=500wt. ppm and a content of other electrolytes <=100wt. ppm in amounts to provide an A/B volume ratio of 0.8-1/1-0.8 and, optionally, 0.01-0.5wt% cure accelerator (C) such as an imidazole.
申请公布号 JPS61247725(A) 申请公布日期 1986.11.05
申请号 JP19850088997 申请日期 1985.04.26
申请人 SUMITOMO BAKELITE CO LTD 发明人 KOSHIBE SHIGERU
分类号 C08G59/00;C08G59/62;C08L63/00;H01L23/29;H01L23/31 主分类号 C08G59/00
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