发明名称 WAFER POSITIONING DEVICE
摘要 PURPOSE:To obtain the positioning device with which a wafer can be positioned in a highly accurate manner under a non-contact state by a method wherein a DELTAtheta stage and a theta stage are provided on an X-Y stage by arranging them on the same axis, and a plurality of detection elements and the like arranged in parallel are provided in addition to the above. CONSTITUTION:A DELTAtheta stage 10, which is swingingly movable around a Z-axis, is placed on stages 8 and 9 which can be moved in X-Y 2 direction, and a theta stage 11 which makes one or more revolutions is provided on the same axis of said DELTAtheta stage 10. Besides, a plurality of detecting devices with which the shade of a wafer 20 generated by the illumination made from one side of the wafer 20 will be projected on the detecting elements 25-27 arranged in parallel using an optical system, and a device with which the value detected by said detecting device will be memorized and computed are provided. Then, based on the signal of the detecting device, the wafer 20 is positioned at the prescribed position by shifting the X-Y stages 8 and 9, and the theta and DELTAtheta stages 10 and 11.
申请公布号 JPS60192345(A) 申请公布日期 1985.09.30
申请号 JP19840047014 申请日期 1984.03.14
申请人 HITACHI SEISAKUSHO KK 发明人 NAKAJIMA NAOTO;TANIMOTO TETSUZOU
分类号 H01L21/30;G03F7/20;H01L21/027;H01L21/67;H01L21/68 主分类号 H01L21/30
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