| 摘要 |
PURPOSE:To enable to directly observe the crack of a passivation film on the surface of a pellet occurred due to a stress applied to a semiconductor device, displacements of wirings and disconnection of wirings by providing wirings disposed in a square shape of multiplex in parallel through an equal interval on a semiconductor substrate, and the passivation film for coating the entire pellet surface. CONSTITUTION:Aluminum wirings 2 are disposed in parallel through an equal interval at four sides on a semiconductor substrate 1, and a passivation film 3 is then coated on the surface. Then, the pellet is associated in a vessel, sealed with resin, and a stress is then applied as sealed. At this time, a stress is generated in the pellet, irreversible crack of the film 3, displacement of the wirings 2 and disconnection of the wirings 2 occur in response to the strength and distribution of the stress. The resin sealed as the vessel is eventually exfoliated, and the pellet is then observed. Thus, the states of the crack of the film 3, the displacement of the wirings 2, the disconnection of the wirings 2 occurred by the relationship between the type of the vessel used and the size of the pellet can be directly observed and commonly used as design information for general utility. |
