| 摘要 |
A furnace loading system is provided for loading and unloading wafer boats or other receptacles from a furnace tube of the type used in semiconductor processing. The system includes a carrier for supporting the receptacles in a cantilevered manner out of contact with the furnace tube. Actuators are provided for moving the carrier and receptacles into the furnace tube and for depositing the receptacles on the floor of the furnace tube without any contact between the carrier and the furnace tube. The carrier is then withdrawn, completing the loading cycle. Unloading is accomplished by inserting the carrier into the furnace tube while supported in a cantilevered manner. The carrier is then raised to pick up and support the receptacles on the carrier, after which they are withdrawn from the furnace tube. Only the feet of the receptacles contact the furnace tube, reducing particulate matter generation to a minimum. All parts of the apparatus which enter the furnace tube are formed of quartz or another semiconductor grade material. Consequently, the furnace temperature can be maintained at a relatively high level throughout the loading and unloading process without melting or sagging of the loader components. The system leaves less mass in the furnace tube to be heated and cooled, providing for greater uniformity and lower costs in the processing of semiconductors.
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