| 摘要 |
PURPOSE:To enhance mass-producibility and yield in manufacture and firmly bond a flip chip without breaking a wiring pattern, by a method wherein electrodes of a chip are connected to a wiring pattern comprising a two-layer construction of aluminum and nickel provided on an insulating substrate, by wireless bonding. CONSTITUTION:The wiring pattern on the substrate 1 on which the flip chip as a driving IC element is to be mounted and connected is provided with a two-layer construction of aluminum and nickel. Therefore, the wiring pattern for connecting each electrode of the flip chip 3 is provided with the two-layer construction comprising lower layers 6a, 11a, 12a of aluminum and upper layers 6b, 11b, 12b of nickel. With the wiring pattern provided with the two-layer construction, since aluminum has low specific resistance and good affinity with aluminum and is hardly absorbed into a molten solder, a wiring pattern having a high bonding strength and an extremely small power loss can be provided on the insulating substrate 1. In addition, since nickel has excellent wettability with the solder and is hardly absorbed into the molten solder, the flip chip 3 can be firmly connected by soldering to the wiring pattern. |
