| 摘要 |
PURPOSE:To improve the curability, molding workability, etc., of a resin composition containing a novolak phenolic resin as a curing agent, by adding thereto 2-phenyl-4,5-dihydroxymethylimidazole as a cure accelerator. CONSTITUTION:The purpose epoxy resin composition for sealing semiconductors is prepared by mixing an epoxy resin (A) (e.g., cresol novolak epoxy resin) with a novolak phenolic resin (B) as a curing agent, 2-phenyl-4,5- dihydroxymethylimidazole (C) as a cure accelerator, a filler (D) (e.g., silica or glass) and, optionally, additives (E) such as a mold release, colorant and flame retardant. This resin composition can be suitably used for sealing semiconductor elements such as transistors, IC or LSI by transfer molding.
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