| 摘要 |
PURPOSE:To fix opposing electrodes of a semiconductor element using the same kind of solder by a method wherein heat capacity is augmented around electrods while a heat insulating box is used to heat multiple positions without fail up to around 215 deg.C for local heating by blast from nozzles. CONSTITUTION:Embossed parts 2 are implanted with protective layers 3 while separate electrodes 4 made of more ferrous material are provided protrusively from the resin layers 3. An external terminals 14 formed into L type is arranged to solder two each of diode 1 per conductive pattern 12 using lead-tin solder with melting point of around 210 deg.C. The external terminal 14 magnetically stabilized by a magnet 8 is brought into contact with the separate electrodes 4 of diodes 1 comprising a part of assembled body through the intermediary of a Pb-Sn solder tablet 10 while the integrated part is conveyed to a heat insulating box 17 by a flat belt 16. The heat insulating box 17 is controlled by a temperature detector 20 and an infrared heater 19 while hot blast is sent from nozzles 18 to the external terminal 14 located between the separate electrodes 4. |
