发明名称 CURABLE EPOXY RESIN COMPOSITION
摘要 PURPOSE:To obtain an one-pack type composition of good storage stability at room temperature, readily curable at relatively low temperatures, excellent in the physical properties of the cured product there from, by blending epoxy resin, specific curing accelerator and acid anhydride curing agent. CONSTITUTION:The objective composition can be obtained by blending the following three components; (A) an epoxy resin having in one molecule at least one adjacent epoxy group on the average, (B) a curing accelerator consisting of reaction product prepared by reaction between (i) an epoxy-amine adduct derived from reaction between a) an amino compound of formula (R1 and R2 are each 1-5C alkyl; X is 1-5C alkylene) and b) an epoxy resin having in one molecule at leastone adjacent epoxy group on the average in such amounts as to be 0.8-2.5 equivalents of the epoxy group in the epoxy resin per equivalent of the amino group in the component a) and (ii) at least one kind of compound selected from phenolic resin and polyhydric phenol compounds and (C) an acid anhydride curing agent.
申请公布号 JPS61236816(A) 申请公布日期 1986.10.22
申请号 JP19850077792 申请日期 1985.04.12
申请人 ASAHI DENKA KOGYO KK;EE C R KK 发明人 SUZUKI HIROSHI;MATSUI AKIRA
分类号 C08G59/00;C08G59/40;C08G59/42;C08G59/62;C08L63/00 主分类号 C08G59/00
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