| 摘要 |
A component module (15, 70), adapted for piggyback mounting on an IC Dip (51,81), preferably incorporates a decoupling capacitor (18, 44, 74), with opposite end electrodes (23, 24), encapsulated within a molded housing (21, 72) of preferably parallelepiped configuration. The electrodes are uniquely connected to only two of preferably four rectangularly shaped terminals (26-29, 76-79) that project downwardly from different corners of the housing. The terminals, as well as an optional heat sink (61) are preferably formed out of a strip stock carrier (33). The two capacitor-connected terminals (27, 29 and 77, 79) are uniquely diagonally disposed and spaced, for a decoupling application, so as to respectively engage the battery and ground leads of a standard pin-out DIP (51, 81). The other two diagonally disposed component module terminals (26, 28 or 76, 78) are electrically isolated from the capacitor, being employed only to facilitate the mounting of the module on an associated DIP. In one component module embodiment (15, FIG. 1), the terminals (26-29) are adapted for soldered securement to a circuit board (54), whereas in a second embodiment (70, FIG. 6) the terminals (76-79) are adapted to be snap-locked on and, thereafter, soldered to, upper horizontal shoulder portion (82a) of respectively aligned leads (82) of a supporting DIP (81).
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