| 摘要 |
PURPOSE:To accelerate the signal processing speed while shortening the wire length by a method wherein the end of lead is extended to the circuit forming face side of a pellet while bonding to the circuit forming face of the pellet to bond the lead to the nearest bonding pad by wire bonding process. CONSTITUTION:The inner end of a lead 1 as an outer terminal is bonded to the surface of a pellet 2 as a circuit forming face using silicon rubber base bonding agent 3. Moreover the inner end and the surface are electrically connected to each other by a bonding pad 4 of the pellet 2 and a wire 5. A package 6 is formed with said elements sealed as they are with epoxy resin. In such a constitution, the end of lead 1 is extended to the position near the bonding pad 4 on the surface of pellet 2 to extremely shorten the wire 5 besides the bonding pad 4 can be mounted on the pertinent position to receive signals from each circuit element within the shortest time. |
