发明名称 POSITIVE TYPE PHOTORESIST DEVELOPING SOLUTION
摘要 PURPOSE:To enhance selective solubility between the photoresist at the exposed areas and the nonexposed areas by incorporating a specified quaternary ammo nium compd. in a developing soln. of a positive type photoresist composed essentially of an org. base contg. no metal ion. CONSTITUTION:The positive type photoresist developing soln. capable of extreme ly enhancing the selective solubility of a resist film at the exposed areas and nonexposed areas, and at the same time, enhancing resolution, and restraining adhesion of the residues of the thin resist film and the scum is composed essen tially of the org. base contg. no metal ion in an amt. of 1-10pts.wt., preferably, 2-6 per 100pts.wt. of an aq. soln., further contains, in an amt. of 0.01-10, preferably, 0.1-10pts.wt. per 100pts.wt. of said solute, the quaternary ammonium compd. represented by the formula shown on the right in which R is <=8C alkyl; and X is halogen or OH. The developing soln. may contain other additives usually used, when needed, such as humectant, stabilizer, or solubilizing aid.
申请公布号 JPS61232454(A) 申请公布日期 1986.10.16
申请号 JP19850073748 申请日期 1985.04.08
申请人 TOKYO OHKA KOGYO CO LTD 发明人 TANAKA HATSUYUKI;ITO NAOKI;ASAUMI SHINGO;YOKOTA AKIRA;NAKANE HISASHI
分类号 G03C1/72;G03F7/32;H01L21/027;H01L21/30 主分类号 G03C1/72
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