| 摘要 |
PURPOSE:To blow off excess solder between leads for an integrated circuit by an air flow at a high temperature, and to prevent a short circuit by solder between the leads effectively by blowing the air flow against the leads at high speed. CONSTITUTION:Solder dissolved by a heater 18 is pressed into the lower side of a partition plate 13 by a pump blade 17, and jetted from a nozzle 15. A flat IC 2 is lowered by a fluid pressure cylinder, etc. on the nozzle 15, and the whole IC 2 is inserted into dissolved solder 22 jetted from the nozzle 15, and elevated. An air flow at a high temperature is blown against the flat IC 2 pulled out of the inside of the jetted solder on the side slightly upper than the upper surface of dissolved solder 22 constituted from the nozzle 15, and a hot-air spraying nozzle 31 blowing off excess solder on one lead is disposed. A heating box 33 is connected to the nozzle 31 through a pipe 32, and a blower 35 is connected through a duct 34. A solenoid valve 36 is fitted into the duct 34, and the solenoid valve is operated by a photoelectric sensor, etc. detecting the flat IC 2 intending to ascend.
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