| 摘要 |
PURPOSE:To provide easy and quick separation from a holder for a grinding base plate after completion of the grinding work by furnishing a notch in a certain specific position of the location hole bored in the base plate. CONSTITUTION:A base plate holder 1 is affixed to a jig using a two-side sticky tape 14, and a silicon wafer 2 is held in a base plate locational hole 111 bored in a template 1l1 having a notch 112. Then the jig is mounted on the grinding machine followed by mirror-face grinding, and removed from the machine when grinding is completed. When high-pressure water is injected from said notch 112 with the silicon wafer side 2 facing up, removal from the locational hole 111 one after another is accomplished easily and quickly, wherein each silicon wafer 2 takes an attitude as being afloat. The direction of removal at this time is the same as the injecting direction of said high-pressure water to ensure that wafers 2 do not run against each other, which assures wafers 2 free from risk of damage. |
