发明名称 METALLIZATION OF ELECTRIC INSULATING SURFACE
摘要 <p>The adhesive strength of, in particular, ductile metal layers bound predominantly by mechanical anchorage to the substrate is enhanced by a controlled increase of the hardness of these metal layers by formation of an alloy or by precipitation hardening, preferably in the zone of the metal layers close to the substrate. This is achieved by means of an interlayer which is applied to the substrates before the application of the metal layer or is effected afterwards by a heat treatment.</p>
申请公布号 JPS61231179(A) 申请公布日期 1986.10.15
申请号 JP19860074401 申请日期 1986.04.02
申请人 LICENTIA PATENT VERWALT GMBH 发明人 ROOBERUTO OSUTOBUARUTO
分类号 C04B41/90;C23C18/18;C23C28/02 主分类号 C04B41/90
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