发明名称 ENCAPSULATION
摘要 PURPOSE:To prevent damage of article, deterioration in characteristics and the like from occurring and the predetermined portion of the article from being covered by resin by a method wherein a covering member of a passage, through which resin is poured to the predetermined portion of the article to be embedded, is pressed by a mold. CONSTITUTION:A pallet 12 is die-bonded onto a lead 13b by means of a bonding layer composed of silver paste, soft solder or the like. Resin 22 is applied over the whole top surface of the pellet 12, excluding the portion near bond pads 15a-15d and solidified. The leads 13a-13d and the resin are pressed from above and below by clamping a mold 23 consisting of a top half 23a and a bottom half 23b. Finally, resin is poured in the mold 23 in order to transfer- mold. Because magnetism sensing parts 14a-14d are covered by the resin 22 which is also pressed down by the top half 23a, the resin 16 does not flow in the magnetism sensing parts 14a-14d.
申请公布号 JPS61227007(A) 申请公布日期 1986.10.09
申请号 JP19850067658 申请日期 1985.03.30
申请人 SONY CORP 发明人 MINAMI TOSHIHIKO
分类号 B29C39/10;B29C39/22;B29C45/02;B29L31/34;H01L23/02 主分类号 B29C39/10
代理机构 代理人
主权项
地址
您可能感兴趣的专利