发明名称 SEMICONDUCTOR DEVICE WITH COOLING MEANS
摘要 PURPOSE:To reduce a wiring inductance to elements by a method wherein, when a laminated body comprising switching elements and diodes is immersed in refrigerant in an enclosed container for ebullition and condensation, the laminated body is divided to locate the side of part comprising the switching elements on the position adjacent to the terminal leading out part provided in the container. CONSTITUTION:Diodes 4, 4' and gate turn off thyristors 3, 3' respectively connected in series are contained in an enclosed container 12 while refrigerant 13 filled therein is communicated with a condenser 15 through a communicating tube 14 to the ebullition and condensation of the refrigerant 13 for refrigerating the contrained elements. In such a constitution, the thyristors 3, 3' and the diodes 4, 4' are respectively composed of the first laminated body S1 and the second laminated body S2 with the first laminated body S1 approaching to a terminal fitting surface 18. Through these procedures, the thyristor groups may approach to snubber circuit comprising a diode 5 and a condenser 6 outside the container 12 to reduce the wiring inductance without containing the snubber circuit in the container 12.
申请公布号 AU555550(B2) 申请公布日期 1986.10.02
申请号 AU19850043184 申请日期 1985.05.31
申请人 HITACHI, LTD. 发明人 HIROSHI ITAHANA
分类号 H01L23/44;H01L23/427;H01L25/11;(IPC1-7):H01L23/42;H02M7/515;H01L25/08;H05K7/20 主分类号 H01L23/44
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